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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input NOR Gate With Strobe
The MC10H100 is a quad NOR gate. Each gate has 3 inputs, two of which are independent and one of which is tied common to all four gates. * Propagation Delay, 1.0 ns Typical * 25 mW Typ/Gate (No Load) * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible
MC10H100
L SUFFIX CERAMIC PACKAGE CASE 620-10 P SUFFIX PLASTIC PACKAGE CASE 648-08
MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA
FN SUFFIX PLCC CASE 775-02
LOGIC DIAGRAM
C C 4 5 6 7 9 10 11 12 13 2=4+5+9 A Vdc Vdc Vdc Vdc VCC1 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 2 3
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
0 Characteristic Power Supply Current Input Current High Pin 9 All Other Inputs Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH -- -- IinL VOH VOL VIH VIL 0.5 900 500 -- -- -- 0.5 560 310 -- -- -- 0.3 560 310 -- -0.735 -1.60 -0.735 -1.45 Min -- Max 29 Min -- 25 Max 26 Min -- 75 Max 29 Unit mA A
14
15
-1.02 -0.84 -0.98 -0.81 -0.92 -1.95 -1.63 -1.95 -1.63 -1.95 -1.17 -0.84 -1.13 -0.81 -1.07 -1.95 -1.48 -1.95 -1.48 -1.95
DIP PIN ASSIGNMENT
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 DOUT COUT DIN DIN CIN CIN COMMON INPUT (A, B, C, D)
AC PARAMETERS
Propagation Delay Pin 9 Only Exclude Pin 9 Rise Time Fall Time tpd 0.65 0.4 tr tf 0.5 0.5 1.6 1.3 2.0 2.0 0.7 0.45 0.5 0.5 1.7 1.35 2.1 2.1 0.7 0.5 0.5 0.5 1.8 1.5 2.2 2.2 ns ns ns
AOUT BOUT AIN AIN BIN BIN VEE
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
3/93
(c) Motorola, Inc. 1996
2-26
REV 5
MC10H100
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MECL Data DL122 -- Rev 6
2-27
MOTOROLA
MC10H100
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V
9
-A-
16
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-28
*MC10H100/D*
MC10H100/D MECL Data DL122 -- Rev 6

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